DDR3/3L/2/LPDDR3/2

博亚app网站DDR3/3L/2/LPDDR3/2 Combo IP可提供支持JEDEC标准、兼容SDRAM设备的一站式交钥匙解决方案,低功耗、高速率、小尺寸、时序优化。支持市场上所有的 JEDECDDR3/3L/2/LPDDR3/2 SDRAM组件。PHY组件包含DDR专用功能和实用高性能I/O、关键时序同步模块 (TSM) 和低功耗/抖动DLL,可对任何SDRAM接口进行可编程细粒度控制。且PHY都预先组装了.lib、LEF和GDS,DDRn总线宽度可以从4位到72位或更多,易于集成,缩短客户设计周期。该方案包括Controller和PHY,支持LPDDR3/2,可配置时序、驱动强度参数和各种SDRAM接口,灵活高效。

The INNOSILICON DDR IPTM Mixed-Signal  DDR3/3L/2/LPDDR3/2 Combo PHYs provide turnkey physical interface solutions for  ICs requiring access to JEDEC compatible SDRAM devices. It is optimized for low  power and high speed applications with robust timing and small silicon area. It  supports all JEDEC DDR3/3L/2/LPDDR3/2 SDRAM components in the market. The PHY  components contain LPDDR specialized functional and utility high performance  I/Os, critical timing synchronization module (TSM) and a low power/jitter DLLs  with programmable fine-grain control for any SDRAM interface.

Note that all INNOSILICON PHY is  pre-assembled with.lib, LEF and GDS so that it is very easy to integrate the  PHY with any existing SoC floor plan. DDRn bus width can be from 4 bit to 72  bit or more. INNOSILICON is happy to pre-assemble each PHY for our customer so  that integration becomes extremely easy.

The combo PHY solution includes DDRn  controller and PHY, supporting DDR3/3L/2/LPDDR3/2. With configurable timing and  driving strength parameters to interface to the wide variety of SDRAMs, the PHY  is very flexible with advanced command capability to increase SDRAM operation  efficiency.

KEY FEATURES:

  • Max data rate: 2133Mbps (DDR3/3L), 1333Mbps (DDR2/LPDDR2) and 1600Mbps  (LPDDR3) respectively

  • x16/x32/x64 data path interface extendable

  • 1.2V/1.35V/1.5V/1.8V JEDEC IO standard, support 1.2V POD_12 and  1.35V/1.5V/1.8V SSTL I/Os

  • Multiple drive strengths adjustable

  • Independent read and write timing adjustments with auto calibration

  • Low latency with programmable timings for secure data handling

  • Per bit deskew support

  • Supports point to point memory sub systems and multi-rank

  • PVT compensation and timing calibration for all corner reliability

  • At speed BIST, scan insertion

  • Various power-down modes for low power including self-refresh  support

  • Low jitter with superior noise rejection

  • APB Port register access interface

  • Dual Row IO implementation and more

  • Supports both wire-bond and flip- chip packaging

  • Wire-bond speed is package limited

  • Support different DDRn type signal mapping for feasible PCB layout

  • Fully pre-assemble design, Drop-in hard macro to ease integration  and speed time to market

  • Zero risk with robust ESD architecture

  • Maintains self-refresh I/O drive state during VDD power down

  • Extensive EDA tool support for various design automation flows

  • Optional CKE retention mode permits VDD and all non-essential I/Os  to be powered down while retaining the external SDRAMs in self refresh mode

  • DFI2.1/3.1 compliant memory controller interface

  • Flexible pad ring configuration to adapt for various design and chip  scenarios

  • Integration with other INNOSILICON interface IP

  • Takes full advantage of process power savings and speed capability

  • Best in class low noise design to ensure best timing margin and  signal integrity

  • DFT functions to reduce test time and ensure high test coverage

  • Several programmable PHY operating modes through simple register  interface

  • Per Bit De-skew to improve composite data eye during read cycles at  high speed

INNOSILICON ADVANTAGES:

  • Fully customized solutions including Controller and PHY

  • Over 500,000 wafers shipped out with Innosilicon DDRn/LPDDRn IP

  • All major processes fully covered, such as 110nm, 55nm to 28nm,  22nm, 14nm, 12nm, 8nm, 7nm, 6nm, 5nm.

  • Full harden PHY proven by 100+ tapeouts

  • Simple integration with pre-assembled PHY

  • Low IO pin count

  • High performance

  • Test chip and FPGA integration services available

EXAMPLE APPLICATIONS:

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